Job/Position Summary

3DGS is seeking an experienced and innovative Thermal Management Engineer to design and optimize chip-scale packages for advanced RF and digital electronic products. In this role, you will be responsible for conducting CFD analysis, developing and running experimental tests, and creating thermal solutions that ensure optimal performance and reliability of next-generation electronics. You will collaborate closely with both internal teams and customers to meet targeted milestones and production schedules, ensuring the successful development and deployment of thermal management solutions in cutting-edge advanced packaging applications.

Primary Responsibilities

• Thermal Solution Design: Design innovative thermal management solutions for chip-scale packaging, focusing on RF and digital electronic products, ensuring that thermal performance meets stringent requirements for power dissipation and reliability.
• CFD Analysis: Conduct Computational Fluid Dynamics (CFD) simulations to analyze and optimize heat dissipation within chip packages, identifying potential thermal hotspots, airflow issues, and material constraints.
• Experimental Testing: Develop test setups and test environments to validate thermal models. Perform hands-on testing to assess thermal behavior, including temperature measurements, thermal cycling, and performance evaluations.
• Cross-Functional Collaboration: Work closely with design engineers, manufacturing teams, and customers to integrate thermal management solutions into chip-scale packages. Ensure designs are manufacturable and align with customer requirements and timelines.
• Customer Engagement: Collaborate directly with customers to understand their specific thermal challenges and provide tailored solutions. Present findings and recommendations through clear, data-driven reports and presentations.
• Optimization and Innovation: Identify opportunities for continuous improvement and innovation in thermal management strategies, materials, and processes. Stay updated on emerging technologies in thermal packaging, materials science, and RF engineering.
• Production Support: Work with production teams to ensure smooth transition from prototype to production, addressing any thermal-related issues that arise during the manufacturing or testing phases.
• Schedule & Deliverables Management: Track project milestones and ensure timely delivery of thermal solutions, meeting all key design, validation, and production deadlines.

Requirements

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field. Master's degree preferred.
• 3+ years of experience in thermal management for advanced packaging, preferably in RF, semiconductors, or electronics.
• This position will require lawful access to ITAR/EAR controlled information and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or ability to meet contract-specific licensure requirements.

Knowledge, Skills, and Abilities

• Hands-on experience with CFD simulation tools (e.g., ANSYS Fluent, COMSOL, Star-CCM+).
• Practical experience in designing and conducting thermal experiments (e.g., thermal testing setups, infrared imaging, thermocouples, and thermal cycling tests).
• Strong understanding of chip-scale packaging technologies such as 2.5D/3D integration, flip-chip packages, or system-in-package (SiP) designs.
• Familiarity with thermal interface materials (TIMs), heat sinks, and other thermal components used in electronics packaging.
• Strong analytical skills and the ability to interpret complex thermal data.
• Excellent communication skills with the ability to present findings to both technical and non-technical stakeholders.
• Ability to work collaboratively in a fast-paced, cross-functional team environment.
• Experience with RF electronics and their thermal requirements, such as handling high-frequency signals and ensuring thermal stability in active components preferred.
• Knowledge of thermal modeling and simulation software beyond CFD tools, such as ANSYS Icepak, Flotherm, or OpenFOAM preferred.
• Familiarity with design for manufacturability (DFM) and working closely with production teams to ensure thermal management solutions are practical and cost-effective preferred.
• Experience in working with advanced packaging technologies such as chiplets, memory modules, and high-performance computing systems preferred.
  Six Sigma or Lean Manufacturing experience is a plus.

Physical/Working Requirements

• Must be able to wear personal protective gear most of the day (where applicable)
• Prolonged periods of sitting or standing

Behavioral Traits

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives and engaging all levels of the organization.

Why Join Us?

• Work on cutting-edge technology in the rapidly evolving field of advanced packaging and RF electronics.
• Collaborate with industry-leading experts to solve complex thermal challenges for next-generation products.
• Be part of a dynamic, innovative startup environment, offering significant opportunities for professional growth and career development.
• Opportunity to make a direct impact on high-performance systems used in industries like telecommunications, defense, and computing.